Xiaomi introduced its new in-house mobile SoC, the Xuanjie O3, on Aug. 24, saying the chip is built on Taiwan Semiconductor Manufacturing Co.'s 3nm process and will debut in the Xiaomi 18 Fold in September. According to Xiaomi, CPU performance is up 60% from the prior generation, while GPU performance rises 85%. The company also disclosed a die size of 133 square millimeters and a transistor count of 24 billion, with overall chip scale up 26% from the Xuanjie O1. The launch carries implications for Qualcomm and MediaTek, two long-standing suppliers of mobile processors to Xiaomi. At the time of writing cited by the source, MediaTek shares had fallen 2.26% to NT$3,680, while Qualcomm stock had dropped 1.38% in the previous session to $158.53. Xiaomi Chairman Lei Jun said the company has invested more than RMB 21 billion in chip research and development since restarting large-scale semiconductor efforts five years ago. Xiaomi also presented two other in-house chips, the AI-focused Xuanjie O100 and the smart-driving-oriented Xuanjie D100, pointing to a wider in-house silicon strategy.